Huawei might be getting to grips with the entry and mid-range phone markets, and will soon be making strides in to the flagship field against fierce competition!
We have seen evidence of a new Huawei smartphone in the form of Antutu benchmarks in the past. Those benchmarks showed us that their next premier phone would boast a Kirin 920 chip, an SoC is on par with Qualcomm’s Snapdragon 801 and 805 offerings.
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Benchmarks are one thing, but physical evidence is what we really like to see, and today we got it. The above rear panel is rumoured to be from a new Huawei phone that will have an all alloy body and receive features like a fingerprint scanner. The engineer who leaked the original image on Weibo insists the new phone will be a true smartphone with a very high price tag to match.
For Huawei to make it in the big leagues they are going to need to offer hardcore Android phone users a device with hardware similar to the Vivo Xplay 3S and Oppo Find 7 i.e a 2K screen option, 3GB RAM and advanced camera hardware. Even with such a device though, would you be willing to shell out a wad of cash for a phone with the Huawei logo?
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