It was about time we found out some new info on Huawei’s upcoming hifh end chipset, caller Kirin 970. It seems that their subsidiary (HiSilicon) is getting ready and in cooperation with TSMC they plan to begin mass production of the 10nm SoC in September, providing all the necessary equipment for the upcoming Huawei Mate 10 flagship, anticipated to launch in October.
Gizchina News of the week
This powerful chip is expected to rely once again on the Cortex A73 CPU architecture, but this time it will use a new, improved, 12-core GPU (!), with Huawei aiming to put it on par with Samsung’s Exynos 8895 SoC and Qualcomm’s Snapdragon 835 model.
As we have already informed you, the first phone in the world to use this specific Kirin 970 SoC will be Huawei’s Mate 10 phablet, which will also be the first Huawei device with edge-to-edge 18:9 Full Active screen, with a size of 6” and 2160 x 1080 pixels resolution.
eMMc again?
YES. C’mon Huawei Mate 10 and/or Pro – blow the others away.