According to Chinese media reports in Taiwan, a supply chain source revealed that Huawei will begin mass production of Kirin 985 chip in the third quarter of this year. This chip uses TSMC 7nm enhanced version process. According to supply chain sources, Huawei Kirin 985 chip has entered the design stage. It is expected that the 7nm enhanced wafer test interface will be shipped in large quantities at the end of the second quarter of this year. It will be ready in the third quarter. It is not clear whether Kirin 985 will have a built-in 5G module.
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According to Huawei’s 5G roadmap, the company will launch a new 5G mobile phone in October this year. The release time of Huawei Mate 30 is basically consistent with the shipment time of Kirin 985. Therefore, the Huawei Mate 30 series is likely to be the first mobile phone to adopt this chip. It is understood that the Kirin 985 package uses the Flip-Chip Package-on-Package (FC-PoP) process, and CUHK has taken a large order. Huawei has repeatedly strived to adopt TSMC’s advanced technology with integrated fan-out package (InFO) one-stop service mode to compete with Apple’s A13 processor in performance. However, because of the cost and the extra test procedures, the Kirin 900 series processors are all packaged by ASE and its products.
