New teasers of the soon-to-be-launched Redmi K30 Pro continue to drop by the dozens every two days now as we now get close to a March 24th launch of the handset. Today, the yet-unreleased device has already been subjected to an autopy and some new connectivity features have also been revealed.
Latest teasers say that the Redmi K30 Pro is equipped with Super Bluetooth + Bluetooth 5.1 as standard. Super Bluetooth can effectively expand the range of Bluetooth signals, and it can still stay connected at 400 meters line. Bluetooth 5.1 can provide lower latency without the trouble of audio and video out-of-sync. The other teaser shows dual-mode 5G + Multilink three-way parallel technology. At the same time connect 2.4GHz Wi-Fi, 5GHz Wi-Fi and 4G / 5G mobile network, three channels in parallel, always maintain high-speed download, stable online.
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As for the teardown, Redmi General Manager Lu Weibing revealed today that the Redmi K30 Pro has a densely packed motherboard. As per the teaser, there are 61 components per square centimetre in its chassis. This has been done to save space for the battery and 5G modem while accomodating a pop-up camera. 5G components require more space and thus manufacturers have been avoiding pop-up cameras lately in 5G devices with the K30 Pro being a rare exception this year.
