POCO F2 Pro Liquid Cooling 2.0 teased ahead of launch

A few days back, the global handle for POCO got revived on Twitter and it has been actively teasing its next upcoming smartphone, the POCO F2 Pro. Now, the company has confirmed that the device will feature a “Liquid Cooling 2.0” technology. Earlier, the company had confirmed that the handset is arriving on May 12th.

In a twitter post, POCO Global confirmed the introduction of Liquid Cooling 2.0 technology. The post included a caption saying “Next-gen cooling” is said to be unveiled, with the time remaining for the launch.

This seems plausible as leaks have already pointed that POCO F2 Pro would debut as a rebranded Redmi K30 Pro in global markets. If we recall, the company launched the device in China back in March. The device has 7 layers of graphite structure, covering the battery compartment, the motherboard, and the sound cavity. 

In addition to this, there is another head dissipation layer made of Graphene in the internal motherboard of the Redmi K30 Pro. However, POCO could alter this with a liquid cooling pipe that was found on POCO F1 but we will have to wait until tomorrow for further details.

Regarding the design and specifications of POCO F2 Pro, the latest teaser from the company points to a design similar to Redmi K30 Pro. The phone is expected to come with flagship internals including the latest Qualcomm Snapdragon 865 SoC, an AMOLED display, a quad-camera setup with 64MP Primary sensor, 4700mAh battery and 33W fast charging. The price is rumoured to be around EUR 570 but we will have to wait for an official word from the company.