Over the past few weeks, there have been several reports regarding the successor of the Snapdragon 888, Snapdragon 898 SoC. However, what about the competitors for this flagship processor? Will the Qualcomm Snapdragon 898 have any competition? Yes, it will. Information regarding MediaTek’s top flagship processor, Dimensity 2000 is now trickling in. According to recent reports from popular Weibo leaksters @DCS and @Fertile, the MediaTek Dimensity 2000 will use TSMC’s 4nm process. According to them, this chip will have a stable power consumption and strong hardware specifications.
After adopting the ARM V9 architecture, the performance of the Dimensity 2000 is top-notch. According to the latest report, the Dimensity 2000 will ship in small batches by the end of this year. Furthermore, the first batch of manufacturers is already conducting relevant tests. If all goes well, the launch time of a Dimensity 2000 smartphone may coincide with the Snapdragon 898. This means that there may be a head-on competition between these chips. If we go by the previous market situation, the Snapdragon chip always comes top.
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The CPU of the Dimensity 2000 will be the same as Qualcomm’s next-generation product, Snapdragon 898, or even stronger. As for GPU, it will be stronger than Snapdragon 888, and its power consumption will perform better. This flagship processor is not only stronger than the current Dimensity 1200, it saves more power and is stronger than the Snapdragon 888 series.
Dimensity 2000 running score to exceed 900,000
This chip will use the ARM V9 architecture with a Cortex X2 super-large core. The running score of this chip may exceed 900,000 points. However, projections for the Snapdragon 898 shows that its running score may exceed a million for the first time.
Compared with the Cortex X1 core used by Snapdragon 888, the performance of the X2 core will also increase by at least 17%. Also, the power consumption can reduce by 10%, which means that the energy efficiency is comprehensively better. Furthermore, the performance improvement of the A710 core and the A510 core is also very significant.
Since this year’s Snapdragon 888 and Snapdragon 888 Plus processors have massive power consumption, it is very difficult to suppress the heat of the product itself.
It is worth mentioning that the Snapdragon 898 chip will also use TSMC’s 4nm process. Obviously, this chip will improve performance and also overcome the problem of large heat generation. Therefore, Dimensity 2000 and Snapdragon 898 can be described as rivals.
For now, the Dimensity 1200 is the flagship of the Dimensity series. However, after the arrival of the Diemnsity 2000, the Dimensity 1200 will become the second fiddle.
