MediaTek and Qualcomm have always been rivals in the mobile chip market. The former enjoys a large market share, many thanks to its mid – range and entry – level mobile phone chips. However, in the flagship end, it has always been in Qualcomm’s shadows. In the Android flagship mobile phone market, Snapdragon chips are the mainstay. However, MediaTek is doing all it can to change this. At the start of its 5G Dimensity chips, the company indeed claimed some market share from its greatest rival. However, this is not enough to put the company in the spotlight in the flagship market. According to popular Weibo tech blogger, @DCS, MediaTek’s next-gen flagship SoC is named Dimensity 9300. He claims that this chip adopts TSMC’s N4P process.
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Dimensity 9300 will be launched by Vivo
This 5G SoC is jointly built by Vivo and MediaTek and it will likely be debuted by Vivo X100. This time, the MediaTek Dimensity 9300 uses TSMC’s N4P process. Compared with the original 5nm tech (also known as N5), the N4P performance is improved by 11%. In comparison with N4, the performance is 6% better. In terms of power efficiency, N4P has improved by 22%, and the transistor density has also increased by 6%.
At the same time, the N4P process can easily migrate products based on the 5nm platform. This will reduce customers’ R&D costs, and provide faster and more energy-efficient updates for 5nm platform products. In addition, MediaTek Dimensity 9300 will adopt the layout design of super large core + large core + small core. The super large core should be Cortex X4, the large core may be Cortex A715, and the small core may be A515.
What we know for now is that this new chip will debut in the second half of this year. It will be benchmarked against the Qualcomm Snapdragon 8 Gen3, which will also debut in the second half of this year.
