If you recall, Google launched the Pixel 7 series in October of last year. And now, we’re in September, which means the Pixel 8 lineup is over the horizon. As we approach the launch date, more and more details about the device have been popping up. This time, it’s about the Google Tensor G3 SoC.
I’ve already made an in-depth coverage of the Tensor G3. In that, I’ve explained all the core differences that lie between the G3 and G2. In case you missed it, the main difference between the chipsets is that the new G3 comes with nine cores, while the G2 features an 8-core configuration.
What’s more important is that the additional core of the Tensor G3 is a Cortex-X3 super core. This automatically means that there will be a significant performance boost. But higher performance won’t mean anything if the chipset doesn’t run cool. Well, Samsung Foundry, the chipset manufacturer of the G3, has taken proper measures in this regard.
Gizchina News of the week
Google Tensor G3 Incorporates FO-WLP For Better Thermals
The Tensor G3 chipset will be the first Samsung Foundry chipset to incorporate the FO-WLP packaging. For those wondering, FO-WLP stands for Fan-out water-level packaging. This enhanced water-level packaging gives chipsets better efficiency, improved performance, and, most importantly, lower thermals.
That said, the Tensor G3 won’t be the first chipset to FO-WLP. Qualcomm and MediaTek, two of the leading chipset providers for smartphones, have been using the same packaging for quite a long time. But as mentioned earlier, the G3 will be the first Samsung Foundry chipset to utilize the packaging.
This will make the Tensor G3 run much cooler than the predecessor. And if you’ve used one of the Pixel 7 devices, you may already know that the G2 SoC inside is pretty poor in terms of energy efficiency and thermals. Thankfully, the same won’t be true for the upcoming Pixel 8 series.
