MediaTek held a press conference in Beijing today and officially launched the new Dimensity 8300 mobile chip. This new mobile SoC is positioned as a “low-end” flagship processor. As a new member of the Dimensity 8000 series family, the Dimensity 8300 has advanced generative AI technology. It also comes with high energy efficiency features such as a decent gaming performance as well as a high-speed and stable network connection.
In its blogpost, MediaTek said
“With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to pick and choose between accessibility and premier experiences like flagship-grade memory or accelerated AI capabilities—they can have it all,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency.”
The Dimensity 8300 is also equipped with MediaTek’s new generation “Star Speed Engine”. Through a unique performance algorithm, it can perform real-time resource scheduling based on application performance requirements and device temperature information. This allows users to enjoy high frame stabilization, low power consumption and long battery life. In essence, the gaming and usage experience of the chip is pretty decent. According to MediaTek, the Star Speed Engine not only cooperates extensively with game apps but also expands ecological cooperation with more types of apps and upgrades users’ app experience.
MediaTek Dimensity 8300 Details
CPU Performance
The Dimensity 8300 features an octa-core CPU with 4X Arm Cortex-A715 and 4X Cortex-A510, offering faster apps and superior experiences. According to MediaTek, the chipset boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to its predecessor.
Dimensity 8300 uses TSMC’s second-generation 4nm process and is based on Armv9 CPU architecture. The eight-core CPU includes 4 Cortex-A715 performance cores with a maximum frequency of 3.35GHz and 4 Cortex-A510 energy efficiency cores with a maximum frequency of 2.2GHz.
In addition, Dimensity 8300 also supports flagship LPDDR5X 8533Mbps memory. This chip also comes with a UFS 4.0 flash memory and multi-circular queue technology (Multi-Circular Queue, MCQ). The memory transfer rate is increased by 33% compared with the previous generation. Also, the company said that the flash memory read and write rate is increased by 100%.
GPU Performance
While the CPU details of this new chip are pretty impressive, its GPU specs are not left out. This chip comes with a 6-core Mali-G615 GPU. The peak performance of the GPU is increased by 60% compared with the previous generation. Also, the company said that the power consumption is 55% better than the previous generation. Dimensity 8300 supports excellent memory and flash memory specifications. It offers users with a silky and smooth experience in games, daily applications, imaging and other scenarios.
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Generative AI Capabilities
Dimensity 8300 is the first in its class to support generative AI. In fact, one of the standout features of the Dimensity 8300 is its full generative AI support. This is made possible by the APU 780 AI processor integrated into the chipset. It enables the Dimensity 8300 to provide support for innovative apps that leverage large language models (LLMs) up to 10 billion parameters.
With the integrated generative AI engine, this chip suits the current trend in the industry. The performance of integer operations and floating point operations is 2 times that of the previous generation. It supports transformer operator acceleration and mixed precision INT4 quantization technology. The overall AI performance is 3.3 times faster than that of the previous generation. It can also smoothly run innovative applications of terminal-side generative AI.
Image
Dimensity 8300 supports a 14-bit HDR-ISP Imagiq 980 image processor. This improves the terminal’s computational photography performance and upgrades the photo and video recording experience. Not only can users easily record clearer and sharper 4K60 HDR videos, they can also get longer battery life.
5G Modem
MediaTek Dimensity 8300 integrates the 3GPP R16 5G modem to provide a faster and more stable 5G network experience. Dimensity 8300 is optimized for specific scenarios to achieve smoother 5G connections in weak signal network environments. It also enhances the connection performance and range of Sub-6GHz networks, supports 3 carrier aggregation, and the theoretical peak downlink rate can reach 5.17 Gbps.
Power Efficiency
The chipset is designed to deliver exceptional power efficiency in premier 5G smartphones. MediaTek claims that it has a 30% improvement in power efficiency compared to the previous generation chipset. This chip also comes with MediaTek’s 5G UltraSave 3.0+ power-saving technology. This technology can reduce 5G communication power consumption by up to 20% and ensure long-lasting 5G battery life. Its Wi-Fi 6E has enhanced performance and supports 160MHz bandwidth. With its Wi-Fi Bluetooth hyper-connection technology, the smartphone can simultaneously connect to Bluetooth headsets, wireless handles and other peripherals with lower latency.
Xiaomi Speaks about the Dimensity 8300
Lu Weibing, president of Xiaomi Group and general manager of the Redmi brand, also attended the Dimensity 8300 launch conference. At the event, he announced that the Dimensity 8300-Ultra flagship AI platform is jointly developed by Redmi and MediaTek. He also revealed that the world’s first Dimensity 8300-Ultra phone will be the Redmi K70e. This device as well as the entire Redmi K70 series will be officially released this month.
Conclusion
The MediaTek Dimensity 8300 chipset represents a significant leap forward in mobile technology, offering improved CPU and GPU performance, enhanced generative AI capabilities, and exceptional power efficiency. With these advancements, the Dimensity 8300 is poised to deliver a premium and seamless user experience in the 5G smartphone market.
Author Bio
Efe Udin is a seasoned tech writer with over seven years of experience. He covers a wide range of topics in the tech industry from industry politics to mobile phone performance. From mobile phones to tablets, Efe has also kept a keen eye on the latest advancements and trends. He provides insightful analysis and reviews to inform and educate readers.
