MediaTek has provided confirmation regarding the scheduled launch of the Dimensity 9400+ on April 11th. While this represents an incremental update to the preceding Dimensity 9400, the industry’s focus is directed toward the forthcoming Dimensity 9500. Emerging reports suggest potentially significant advancements in MediaTek’s next flagship chipset.
Information, originating from now-retracted posts by industry tipster Digital Chat Station, indicates the Dimensity 9500 will be manufactured utilizing TSMC’s N3P process and will incorporate an all-big-core ARM CPU architecture.
Dimensity 9500 purported specs leak
The reported core configuration encompasses a single Travis core, three Alto cores, and four Gelas cores. All these, alongside the Immortalis Drage GPU. The Travis and Alto cores will utilize ARM’s forthcoming X9 generation. They will also support Scalable Matrix Extension (SME), intended to enhance multi-threaded performance. The Gelas cores will come from ARM’s next-generation A7 series.
Consequently, the Dimensity 9500 will feature a 1+3+4 CPU configuration. It will pack a Cortex-X930 core, three lower-clocked Cortex-X930 cores, and four Cortex-A730 cores. This represents a revision from earlier reports that suggested a 2+6 CPU arrangement.
According to the leak, the Dimensity 9500 is will debut in mid-2025. This should provide MediaTek with a temporal advantage over Qualcomm’s next flagship chipset, the Snapdragon 8 Elite 2, which – rumours suggest- will come in October 2024.
Furthermore, recent disclosures indicate MediaTek is developing a second all-big-core Dimensity chip, tentatively designated the Dimensity 9450, also utilizing TSMC’s 3nm process. However, detailed specifications for this chip remain limited.
