Ulefone’s been talking about the Future for a while. The company is naturally kicked about getting this phone on the market thanks to it having near-zero bezel.
Ulefone is using that fact to promote the phone as a ‘bezel-less’ one. While we’ve hardly had a chance to see the phone in its full glory in the past, we can thankfully gawk at these pictures of the Future that Andi took today at MWC.
Ulefone Future Photos
Ulefone Future: How bezel-less?
While most such claims in the past have been a sham, Ulefone seem to have actually put some engineering in to making the Future as bezel-less as possible.
Gizchina News of the week
A little narrow black line on the edges can be noticed, but that doesn’t seem like too bad a start for 2016.
We should probably expect some more bezel-less phones — perhaps from larger brands — later this year. As for the Ulefone Future, it should hit the market very soon. It isn’t just the bezels (or the lack of them) that the Future is interesting for; the phone is also one of the first ‘export brand’ Chinese devices to have a fingerprint sensor on the edge.
nice, can you guys get an info on the BQ aquaris x5 plus, the snap dragon 652 pop architechture integrating the RAM.. are all 652s like this? would like to see it
yup
Seems that you don’t really know what PoP is. https://en.wikipedia.org/wiki/Package_on_package
it’s something that everybody has been doing for ages and the RAM is not integrated.
A newer solution that we might see soon at some key SoC players is fan-out wafer level packaging (FOWLP). Apple is assumed to be using TSMC’s InFO (their branding for FOWLP) in the next iphone,likely just the RAM on top of the SoC.
https://www.semiwiki.com/forum/attachments/content/attachments/15378d1442729306-tsmc_info_jpg-jpg
It’s a budget solution to what AMD and soon Nvidia are doing in high end GPUs with interposers and TSV.
http://techreport.com/r.x/amd-hbm/hbm-side-section.jpg
hey i was just reading what BQ said about the chipset “dual channel pop” to be exact
http://www.devicespecifications.com/en/news/cd9755f
http://www.bq.com/es/aquaris-x5-plus (use google to translate the page)
As i said everybody has been using PoP for a long time- more or less 10 years now. it really isn’t anything worth mentioning.
oh i am ignorant to specifics of chips, well i guess ill put this down as another lesson for the day 🙂 maybe i should venture into learning about chips deeply next, gsmarena,gizchina,youtube doesnt feed me enough phone info need to make the next step to feed my lust
On screen buttons are absolutely disgusting, the design is ugly, but the fingerprint placement is spot on.
ulefone i believe mentioned that the onscreen would be removed on the final product
what about the rest of the specs?
coming with the hands on video 😉
eagerly waiting!
This just looks so cheap
Too little side bezels IMO is a problem too, when you hold your phone one handed your palm touches the narrow bezeled sides and triggers the touch making it very annoying.
Seems like they hid the bezel under a rounded glass edge.
Too cheap quality, look at the volume rocker, it is very very loose, and that camera outer shell, too outdated and worst of a design.
Build quality looks a little kak, and the squar look of the camera cover looks a bit back in the day to me… But I really do like what they’re doing with the screen!
Gionee claimed today that the S8 is 74.9mm wide, don’t remember the size of the screen here, if it’s the same 5.5 inch but if it is, lets see if they beat that.
nice, can you guys get an info on the BQ aquaris x5 plus, the snap dragon 652 pop architechture integrating the RAM.. are all 652s like this? would like to see it
yup
Seems that you don’t really know what PoP is. https://en.wikipedia.org/wiki/Package_on_package
it’s something that everybody has been doing for ages and the RAM is not integrated.
A newer solution that we might see soon at some key SoC players is fan-out wafer level packaging (FOWLP). Apple is assumed to be using TSMC’s InFO (their branding for FOWLP) in the next iphone,likely just the RAM on top of the SoC.
https://www.semiwiki.com/forum/attachments/content/attachments/15378d1442729306-tsmc_info_jpg-jpg
http://community.cadence.com/cadence_blogs_8/b/breakfast-bytes/archive/2015/11/30/cowos-info
FOWLP Is a budget solution to what AMD and soon Nvidia are doing in high end GPUs with interposers and TSV.
hey i was just reading what BQ said about the chipset “dual channel pop” to be exact
http://www.devicespecifications.com/en/news/cd9755f
http://www.bq.com/es/aquaris-x5-plus (use google to translate the page)
As i said everybody has been using PoP for a long time- more or less 10 years now. it really isn’t anything worth mentioning, even the first gen iphone was using it for example.
Not using PoP would be notable.
oh i am ignorant to specifics of chips, well i guess ill put this down as another lesson for the day 🙂 maybe i should venture into learning about chips deeply next, gsmarena,gizchina,youtube doesnt feed me enough phone info need to make the next step to feed my lust
On screen buttons are absolutely disgusting, the design is ugly, but the fingerprint placement is spot on.
ulefone i believe mentioned that the onscreen would be removed on the final product
what about the rest of the specs?
coming with the hands on video 😉
eagerly waiting!
This just looks so cheap
Too little side bezels IMO is a problem too, when you hold your phone one handed your palm touches the narrow bezeled sides and triggers the touch making it very annoying.
Seems like they hid the bezel under a rounded glass edge.
Too cheap quality, look at the volume rocker, it is very very loose, and that camera outer shell, too outdated and worst of a design.
This is a BETA version, it’s possible to look cheap… I hope the release version will be better.
you need to stop being so reasonable/ clear minded/ rational in your assesment of this article, enough is enough
Build quality looks a little kak, and the squar look of the camera cover looks a bit back in the day to me… But I really do like what they’re doing with the screen!
Gionee claimed today that the S8 is 74.9mm wide, lets see if they beat that.
Seems like 2 different designers designed this phone. Let’s hope they had fired the one responsible of the back.
This is a BETA version, it’s possible to look cheap… I hope the release version will be better.
you need to stop being so reasonable/ clear minded/ rational in your assesment of this article, enough is enough
Seems like 2 different designers designed this phone. Let’s hope they had fired the one responsible of the back.
Shame about the iClone antennae lines, look awful on the iPhone don’t know why anyone would want to copy.
A little plain. Definitely not the future if it’s some old SoC and low other specs.
unless you were living in a cave , the specs are somewhat already out !
it has p10 and 4GB ram !
Shame about the iClone antennae lines, look awful on the iPhone don’t know why anyone would want to copy.
A little plain. Definitely not the future if it’s some old SoC and low other specs.
unless you were living in a cave , the specs are somewhat already out !
it has p10 and 4GB ram !
looks great !
hopefully will have killer performance AND a great camera with all rounder capabilities !
lets see how its priced !
looks great !
hopefully will have killer performance AND a great camera with all rounder capabilities !
lets see how its priced !