According to sales revenue, Huawei HiSilicon has grown into the largest chip designing company in mainland China. Industry experts now estimate that in 2019, HiSilicon is expected to surpass MediaTek and become the largest IC design company in Asia. Of course, Samsung Electronics also has an IC design business, but because it operates a fab at the same time, it is not an IC design company in the Fabless form.
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According to the 2018 global Top 10 IC design enterprise ranking released by Digitimes Research last week, the income gap between MediaTek and Huawei HiSilicon is about $300 million. However, while MediaTek only managed a 0.9% growth last year, and Huawei’s HiSilicon reached 34.2%.
The reason why the industry chain has the above estimates is that Huawei, which has core intellectual property rights in the field of communications in 2019, will have a large number of technical products for the 5G, AI and IoT fields. In addition, Huawei HiSilicon has placed more orders with TSMC in the second half of the year, and more chip solutions based on the 7nm process.
