MediaTek Dimensity SoC lineup unveiled with dual 5G and Wi-Fi 6 suport

Yesterday we got some exciting news regarding to MediaTek’s 5G chipset. The Taiwanese firm has partnered with Intel to bring 5G for PCs and Laptops. Today, the company has finally revealed all the tidbits about its most ambitious project to the date. A brand new SoC lineup with integrated 5G support. MediaTek calls it Dimensity lineup, and the first 5G SoC is the Dimensity 1000 5G.

The Dimensity 1000 5G is built in the 7nm process, and according to the Taiwanese firm, it is the most power-efficient 5G SoC available in the industry. Also, OEMs working with it will save a lot of space while building their phones since the 5G integrated SoC takes less space than an SoC + 5G Modem solution.

“Our Dimensity series is a culmination of MediaTek’s investment in 5G and positions us as a leader driving 5G development and innovation. Our 5G technolog goes head-to-head with anyone in the industry… We chose the name Dimensity to highlight how our 5G solutions are driving new waves of innovation and experiences, much like the fabled fifth dimension.”

– Joe Chen, MediaTek President

The new 5G SoC supports 5G 2 carrier aggregation and is the first so support dual 5G SIM. Moreover, it is capable of up to 4.7 Gbps downloads and 2.5 Gbps uploads over 5G frequencies below 6 GHz. MediaTek also includes Wi-Fi 6 and Bluetooth 5.1 support straight out the box.

    MediaTek Dimensity 1000 5G SoC specs:

• Clock speed: (4 x Cortex A77 @ 2.6 GHz) + (4 x Cortex A55 @ 2.0 GHz)
• 5G modem: 3GGP Rel. 4.7 Gbps down, 2.5 Gbps up via sub-6 GHz frequencies; NR TDD / NR FDD Bands; *SA / NSA
• 4G modem: TDD/FDD, 4×4 MIMO; 256 QAM; WCDMA, TD-SCDMA, CDMA 1X, EV-DO, GSM / EDGE
• Memory: 4-channel LPDD4x, up to 16GB
• Connectivity: Wi-Fi 6 (2×2 801.11 ax); Bluetooth 5.1; GPS, Glonass, Beidou, Galileo, QZSS, NavIC, Dual *Band L1 + L5 GNSS
• Display: QHD+ @ 90 Hz; DisplayPort support
• Video: 4K @ 60fps; H.264/265/VP9/AV1; Multi-frame Video HDR
• Still imagery: 5-core ISP; up to 80 MP @ 24 shots per second; 32 MP + 16 MP dual camera
• APU: 3rd-gen 5-Core
• Misc: Supports Dual SIM: 5G+5G, 4G+5G, and 5G+ 4G

The Dimensity 1000 5G comes with 5-core ISP (Image signal processor). This way, it can capture up to 80 MP at up to 24 frames per second. Moreover, it supports 32MP + 16MP dual-camera combo. Moreover it comes with 4K@60fps enabled and it also includes Multi-frame video HDR. The latter feature is a first among mobile chipsets.

The new chipset reached over 480,000 on Antutu and 12,096 on GeekBench 4.2. By comparison, devices with the Snapdragon 855+ scored around 490,000 and around 11,000, respectively. For that reason, we can say that MediaTek’s new chipset competes directly with Qualcomm’s offerings. However, the US company will reveal its Snapdragon 865 in the next month. Only then, we will be able to say if the Dimensity will outstand Qualcomm’s next year’s offering.

Despite this, MediaTek claims that its Wi-Fi 6 performs 38% faster than Wi-Fi 5 on the Snapdragon 855 and consumes 40% less power. Interestingly enough, Qualcomm’s offering is clocked at 2.84GHz which is higher than Dimensity’s 2.6GHz clock. Apparently, MediaTek decided to lower the clock for the sake of energy-efficiency.

According to the Taiwanese firm, we’ll see these chipsets coming in the next year. Moreover, it will be present in several smartphones heading to the US in the second half of 2020. China and Asian markets, of course, will be the first markets to prove these chipsets. Also, worth noting that these chips don’t support mmWave as they only work with sub-6 GHz frequencies. However, MediaTek states it would develop another product with 5G mmWave support.

After a long hiatus, it seems that MediaTek is finally ready for the competition. Hopefully, we’ll see more smartphones sporting these chipsets in the next year, breaking a little Qualcomm’s monopoly.

Via