We guess no one doubts the upcoming Xiaomi annual flagship will be a true flagship. It will not only sport the latest hardware but also come with a number of new technologies. This morning, the manufacturer officially announced that the Xiaomi Mi 10 will adopt a three-dimensional cooling system. The latter should ensure better heat dissipation.
Officially, the manufacturer said: ‘We have made a wholehearted whole-body heat dissipation design for the Xiaomi Mi 10: 1. Material sufficient: Super VC, Super graphite, Core flagship graphene; 2. More accurate: Increased from 1 temperature control point to 5, Artificial intelligence dynamically adjusts thermal design.’
Apart from this, the company released the poster of the Xiaomi Mi 10, showcasing some design elements and the overall look of the handset. As it says, this is a high-end flagship phone built for dreams, and a masterpiece of Xiaomi’s ten-year success.’
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As for core features, the Mi 10 will sport a Snapdragon 865 chip. The whole series will use LPDDR5 memory, WiFi 6, UFS 3.0 storage, and a rear 108MP vertically arranged quad-camera (48MP + 12MP + 8MP sensor). In terms of the overall design, the Xiaomi Mi 10 series come with a curved screen.
By the way, Micon has recently released the LPDDR5 DRAM chip and this phone will be the first to come with it. At the same time, the UFS 3.0 flash storage provides twice faster read/write speed than that of the previous generation storage.
At present, the Xiaomi Mi 10 has been confirmed to come on February 13, and an appointment is now open. The international variant of this phone will be unveiled on February 23 in Barcelona, Spain.
