In April this year, Honor Play4T was released using a 6.39-inch display as well as a rear fingerprint recognition solution. However, this smartphone comes with the Huawei HiSilicon Kirin 710A SoC. According to the “Technology Board Daily” report, this mobile chip “Kirin 710A” starts mass production and it uses SMIC 14nm process. This chip clocks at 2.0GHz which means that it is a frequency downgrade relative to Kirin 710. “Kirin 710A” represents a breakthrough in achieving zero localization and is an ice-breaking move for China’s semiconductor chip technology.
Recall that Huawei is currently TSMC’s second-largest customer behind Apple. However, its orders with TSMC may significantly reduce especially if other foundries step up their game. Huawei is slowly moving its orders from TSMC and its starting with the Kirin 710A. Huawei does not have an issue with TSMC, however, TSMC is now a target for the U.S. government.
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Thus, Huawei is getting prepared ahead of time. Although TSMC is a Taiwanese company, it uses some American technology in its manufacturing process. There are speculations that the American government is seeking to place a ban on TSMC that would limit its use of American technology on Huawei’s chips.
HONOR Play 4T with Kirin 710A specifications
- 6.39-inch (720 x 1560 pixels) IPS LCD capacitive touchscreen
- Octa-Core Kirin 710A 12nm (4×2.2 GHz Cortex-A73 & 4×1.7 GHz Cortex-A53) processor with ARM Mali-G51 MP4 GPU
- 6GB of RAM with 128GB storage, expandable memory up to 256GB with microSD
- Android 10, Magic UI 3, no Google Play Services
- Dual SIM
- 48MP rear camera with f/1.8 aperture, LED flash, 8MP ultra-wide sensor with f/2.4 aperture, 2MP depth camera with f/2.4 aperture
- 8MP front-facing camera HDR and 1080p@30fps
- Dimensions: 159.8 x 76.1 x 8.1 mm; Weight:176g
- Rear-mounted fingerprint sensor
- Dual 4G VoLTE, Wi-Fi 802.11 ac (2.4GHz + 5GHz), Bluetooth 5.0 LE, GPS + GLONASS, USB Type-C
- 4000mAh (typical) / 3900mAh (minimum) battery with 10W fast charging
