The Taiwanese chipmaker MediaTek has released its new budget Dimensity 700 chip this month. The chip is designed to bring 5G connectivity to affordable devices for under $200.
Oddly enough, but, apparently, the first brand preparing a smartphone on this chip will be Huawei. A fresh data leak from the well-known Chinese insider Digital Chat Station showed the main technical characteristics of a future Huawei smartphone, among which we have a Dimensity 700 as a CPU.
Huawei prepares to launch a new device based on the Dimensity 700 SoC
According to the leaker, the upcoming device from the Chinese company will be equipped with a 6.5-inch IPS-display, in which the manufacturer will make a hole for the front camera in the upper left corner. As expected for a budget smartphone, the screen will support a refresh rate of 60 Hz, but the FullHD+ resolution will please. Unfortunately, Digital Chat Station did not tell us what options for RAM and storage memory we should expect.